HDI Mainboard Rigid-Flex Circuit board PCB

FOB Price: US $0.5 – 9,999 / Piece
Min.Order Quantity: 1 Piece/Pieces
Supply Ability: 10000 Piece/Pieces per Month
Port: Shenzhen
Payment Terms: L/C,D/A,D/P,T/T

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DESCRIPTION

Features-Our Products Advantage

1. Over 10 years experience manufacturer in PCB Assemble and PCB field.
2. Big scale of producing makes sure that your purchase cost is lower.
3. Advanced production line guarantees stable quality and long life span.
4. Produce almost any PCB as your requirement.
5. 100% test for all customized PCB products.
6. One-stop Service ,we can help to purchase the components.

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm – .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. – .00047 in. (.012mm)–rarely used
1/2 oz. – .0007 in. (.018mm)
1 oz. – .0014 in. (.036mm)
2 oz. – .0028 in. (.071mm)
Solder Mask: Customized
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm – .127mm)
with 0.5 to 2 mil Adhesive (.012mm – .051mm)
LPI and LDI Flexible Soldermasks

Flex PCB Capability

Fastline Circuits Co., Limited
FPC Technology and Capabilities
Material	FR4, Polyimide / Polyester
Counts	Flex: 1~8L; Rigid-Flex: 2~8L
Board Thickness	Min.0.05mm; Max. 0.3mm
Copper Thickness	1/3 oz — 2 oz
CNC Drill Size (Max)	6.5mm
CNC Drill Size (Min)	Flex: 0.15mm
Holes Location Tolerance	±0.05mm
Coverlay Drill Size (Min)	0.6mm
Hole to Coverlay Opening Windows (Min)	0.15mm
Min Line Width / Spacing	0.1/0.1mm
Copper Thickness on Hole Wall	Flex:12-22μm
Min Pad Size	φ0.2mm
Etch Tolerance	Finished line width tolerance ±20%
Pattern Registration Tolerance	±0.1mm (Working Panel Size: 250*300mm)
Coverlay Registration Tolerance	±0.15mm
Solder Mask Registration Tolerance	±0.2mm
Solder Mask to PAD	Non photosensitive: 0.2mm
Solder Mask to PAD	Photosensitive: 0.1mm
Min. Solder Mask Dam	0.1mm
Misregistration Tolerance	±0.30mm
for Stiffener, Adhesive, Glue paper	±0.30mm
Surface Finish	Plating Ni / Au ; Chemical Ni / Au ; OSP

PCB Prototype Lead Time:
item	General time	Quick Turn
1-2 Layers	4 days	1 days
4-6 Layers	6 days	2 days
8-10 Layers	8 days	3 days
12-16 Layers	12 days	4 days
18-20 Layers	14 days	5 days
22-26 Layers	16 days	6 days
Note: Base on all data received by us and must be complete and problem free, Lead time is ready to ship.

We believe that the quality is the soul of an enterprise and provides time-critical, technologically advanced engineering and manufacturing services for the electronics industry.

HDI Mainboard Rigid-Flex Circuit board PCB