Electronics Controlling Rigid-Flex PCB

Electronics Controlling Rigid-Flex PCB

  • FOB Price: US $0.5 – 9,999 / Piece
  • Min.Order Quantity: 1 Piece/Pieces
  • Supply Ability: 10000 Piece/Pieces per Month
  • Port: Shenzhen
  • Payment Terms: L/C,D/A,D/P,T/T

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DESCRIPTION

Features-Our Products Advantage

1. Over 10 years experience manufacturer in PCB Assemble and PCB field.
2. Big scale of producing makes sure that your purchase cost is lower.
3. Advanced production line guarantees stable quality and long life span.
4. Produce almost any PCB as your requirement.
5. 100% test for all customized PCB products.
6. One-stop Service ,we can help to purchase the components.

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm – .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. – .00047 in. (.012mm)–rarely used
1/2 oz. – .0007 in. (.018mm)
1 oz. – .0014 in. (.036mm)
2 oz. – .0028 in. (.071mm)
Solder Mask: Customized
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm – .127mm)
with 0.5 to 2 mil Adhesive (.012mm – .051mm)
LPI and LDI Flexible Soldermasks

Flex PCB Capability

Fastline Circuits Co., Limited
FPC Technology and Capabilities
Material FR4, Polyimide / Polyester
Counts Flex: 1~8L; Rigid-Flex: 2~8L
Board Thickness Min.0.05mm;  Max. 0.3mm
Copper Thickness 1/3 oz — 2 oz
CNC Drill Size (Max) 6.5mm
CNC Drill Size (Min) Flex: 0.15mm
Holes Location Tolerance ±0.05mm
Coverlay Drill Size (Min) 0.6mm
Hole to Coverlay Opening Windows (Min) 0.15mm
Min Line Width / Spacing 0.1/0.1mm
Copper Thickness on Hole Wall Flex:12-22μm
Min Pad Size φ0.2mm
Etch Tolerance Finished line width tolerance ±20%
Pattern Registration Tolerance ±0.1mm (Working Panel Size: 250*300mm)
Coverlay Registration Tolerance ±0.15mm
Solder Mask Registration Tolerance ±0.2mm
Solder Mask to PAD Non photosensitive: 0.2mm
Photosensitive: 0.1mm
Min. Solder Mask Dam 0.1mm
Misregistration Tolerance ±0.30mm
 for Stiffener, Adhesive, Glue paper
Surface Finish Plating Ni / Au ; Chemical Ni / Au ; OSP
PCB  Prototype  Lead  Time:

item

General  time

Quick  Turn

1-2    Layers

4  days

1  days

4-6  Layers

6  days

2  days

8-10  Layers

8  days

3  days

12-16  Layers

12  days

4    days

18-20  Layers

14  days

5  days

22-26  Layers

16  days

6  days
Note: Base on all data received by us and must be complete and problem free, Lead time is ready to ship.

We believe that the quality is the soul of an enterprise and provides time-critical, technologically advanced engineering and manufacturing services for the electronics industry.

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